♣ 晶圆自动抛光(Auto Wafer Polishing)
♣ 高精确研磨工序(High performance planarization process)
♣ 可信懒的高品质(Super-Qualified Reliability)
♣ 可抛光多种晶圆(Various Wafer Polishing Usage)
♣ 先进的可控制区的抛光头(Advanced Carrier Zone Controls)
♣      可在线(In-situ)和脱机(Ex-situ)修整抛光垫，研磨垫调节器操作时可控制13个区间
(In & Ex-situ Pad  Conditioning)
♣ 内有清洗机，有两个带双侧刷的室，外加甩干机(With Cleaner in, includes 2 Chamber Double Side Brush Cleaning and Spin Dryer)
♣ 真实的数据画面&数据保存(Real Data monitor & Save Data)